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About Us

Build the Bridge that Connect Future

History

2021
  • Oct
    2layer type FCCL raw material development and approval in China
2021
  • Mar
    Developed and sold Sn raw materials for SMD gasket
2020
  • Mar
    Developed Cu/Gold Coated EMI Sputter materials on PI Film and sold Huawei
2019
  • Mar
    Developed Ni-free, Sputter-type Gold Copper Foil on copper foil film and sold to Chinese company O)
2018
  • Apr
    Developed and patented stretchable EMI shielding film (jointly with Company A)
2018
  • Mar
    Developed and patented a 2-layer heat dissipation sheet without adhesive on graphite
2017
  • Feb
    Developed and patented ultra-fine copper foil film
2016
  • Jan
    Developed Gold Film and Ag Film for high frequency EMI
2015
  • Nov
    Developed transparent FCCL and small volume production and sales
2014
  • Jul
    Expanded Roll to Roll Sputtering facilities (total 12 units) and developed transparent FCCL
2013
  • Jul
    Relocation of factory and expansion of Roll to Roll Sputtering facilities 6 units
2012
  • Mar
    Mass-production application of metal on ITO film for capacitive touch to Samsung
2011
  • May
    Application of raw material for capacitive touch film to Samsung Smart Phone
2010
  • Mar
    Converted to a corporation of PAN System Co., Ltd.
2009
  • Dec
    Atmospheric pressure plasma facility development and process development
2008
  • Dec
    Improvement and development of metal on ITO surface treatment equipment
2008
  • Dec
    Development of metallizing raw materials for capacitive touch panel
2007
  • Oct
    COF raw materials (company J) and joint development company S approval
2006
  • May
    Developed and applied silver reflective film for LCD
2005
  • May
    Development of raw materials for COF Start joint venture with J
2004
  • Dec
    Developed polymer film surface treatment device
2003
  • Oct
    Roll to Roll Sputtering localization No. 1 facility development
2002
  • Dec
    Startup PAN System