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About Us
Company Overview
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Mission
Our Technology
Sputtering
5G Mobile Communications
Product
FCCL
Transparent FCCL
Gold Coated Copper Foil
Gold Coated Flexible Film
Ultra-Thin Copper Foil
Metallized Film For Touch
Facility&Capacity
Facility&Capacity
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Our technology
Build the Bridge that Connect Future
Sputtering
5G Mobile Communications
5G Mobile Communications
Optimal technology for FCCL for 5G communication devices
High Speed FPC
Low dielectric(MPI, PTFE etc)
Low Roughness of Cu Surface →
Sputter FCCL
High Peel Strength
High Precision FPC
Fine Pattern Process (SAP, MSAP)
Thin Material
:
Micro Thin Copper →
Sputter FCCL &
Ultra-Thin Copper Foil
Low Noise & Heat Sink
EMI
:
Low Roughness & Material Design
→ Sputter Technology
Heat Sink
:
Direct Metallizing
→ Sputter & Plating Technology