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Build the Bridge that Connect Future

5G Mobile Communications

Optimal technology for FCCL for 5G communication devices

High Speed FPC
  • Low dielectric(MPI, PTFE etc)
  • Low Roughness of Cu Surface → Sputter FCCL
  • High Peel Strength
High Precision FPC
  • Fine Pattern Process (SAP, MSAP)
  • Thin Material :
    Micro Thin Copper →
    Sputter FCCL &
    Ultra-Thin Copper Foil
Low Noise & Heat Sink
  • EMI :
    Low Roughness & Material Design
    → Sputter Technology
  • Heat Sink :
    Direct Metallizing
    → Sputter & Plating Technology