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Ultra-Thin Copper Foil

Ultra-Thin Copper Foil

It is a very thin copper foil of less than 2um with a carrier (Aluminum, PET, PI, etc.) attached. It is characterized by separation of the carrier and copper foil. It is used as a raw material for semiconductor packages and high-speed transmission boards.

Ultra-Thin Copper Foil Applicable Areas

  • [Substrate for IC Package]
  • [MSAP for PCB]
  • [For High Transmission]