Double(Single) Side Flexible Copper Clad Laminate Merit
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The world's highest level
of room temperature
peel strength
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Cr-Free Seed
Layer
- No additional etching required
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Optimal product for 5G communication devices such as smartphones
- Low dielectric MPI applicable,
low loss characteristics due to low roughness
- Circuit miniaturization, EMI, high-speed transmission, heat dissipation performance
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Suitable for forming semi-additive circuits